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UltraSoC partners Teledyne LeCroy to unify system design analytics

UltraSoC partners Teledyne LeCroy to unify system design analytics

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By eeNews Europe



Teledyne LeCroy delivers a range of hardware and software tools that enables engineers to verify, test, debug, and validate electronic system designs. UltraSoC provides silicon IP for data acquisition and analysis that can be ‘baked-in’ to the complex semiconductor devices (System on Chip or SoC) at the heart of such designs. The combination of Teledyne LeCroy’s ability to provide a high-level view of system behavior and UltraSoC’s capabilities to offer visibility deep within the SoC creates a powerful toolset that allows the engineer to quickly and instinctively understand the system’s operation, spot problems and devise solutions.

The joint developments will benefit designers of a broad range of end-products. For example, hard disk manufacturers could combine protocol analysis of the external system-level interfaces, such as SATA, gathered via one or more Teledyne LeCroy instruments, with data gathered internally to the drive’s controller chip by UltraSoC’s UltraDebug technology. The capability will enable system developers to track information, including time sensitive events, as it flows from one side of an interface to another and correlate it with internal software execution.

“Teledyne LeCroy is the leading name in protocol test; electronic design engineers around the world rely upon their solutions every day,” said Rupert Baines, UltraSoC CEO.  “We believe that the combination of UltraSoC and Teledyne LeCroy technology will put a powerful and unique capability in the hands of those engineers, not just making their job easier but also fostering innovation and problem-solving.”


Joe Mendolia, Vice President of Marketing at Teledyne LeCroy, said:  “Building dedicated debug and analytics IP into semiconductor devices dramatically eases the task of post-silicon validation and debug, one of the key bottlenecks in time-to-market today.  UltraSoC’s technology allows SoC designers to put together IP and processing cores from multiple vendors, with a unified on-chip analytics capability. Teledyne LeCroy’s key strengths are clearly complementary – in acquiring, displaying, and contextualizing such data.”

Joint work by the two companies will build on the capabilities of Teledyne LeCroy’s protocol analysis instruments, CrossSync and InSight tools, combining these with UltraSoC’s UltraDebug technology.

Related articles and links:

www.teledynelecroy.com

www.ultrasoc.com

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