Unidirectional ESD protection in a 01005 flip chip package
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By
Julien Happich
Designed in space-saving 01005 flip chip packages measuring 0.230×0.430mm, the SP3145 series TVS diode arrays can withstand multiple electrostatic discharge (ESD) events without wear-out or degradation. Its low nominal capacitance (0.35pF) makes this series suitable for interfaces running at high data rates approaching 5GHz clock speeds. The general purpose SP1043 (8pF) and SP1044 (30pF) devices employ proprietary silicon avalanche technology to protect the I/O ports of electronic equipment subject to destructive ESD. These robust diodes can safely absorb repetitive ESD strikes at ±12kV (for SP1043) or ±30kV (for SP1044) without performance degradation.
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