The US National Science Foundation (NSF) has awarded $50 million to an R&D partnership between Ericsson, IBM, Intel and Samsung to work on next-generation chips.
The partnership is part of NSF’s Future of Semiconductors (FuSe) initiative.
“Future semiconductors and microelectronics will require transdisciplinary research spanning materials, devices, and systems, as well as the engagement of the full spectrum of talent in the academic and industrial sectors,” said NSF Director Sethuraman Panchanathan. “Partnerships such as this are essential to inform research needs, spur innovation, accelerate the translation of results to the market, and prepare the future workforce.”
NSF will team with Ericsson, IBM, Intel, and Samsung to invest in multiple projects across a broad front but based on “co-design” approaches, the NSF said. Co-design approaches simultaneously consider the performance at the device, chip and system level, manufacturability, recyclability, and impact on the environment.
The latest move builds on three NSF developments related to semiconductor workforce development, announced recently.
These were a partnership with the Semiconductor Research Corporation, a $10 million funding with Intel and $10 million partnership with Micron Technology Inc.