US looks to $200m CHIPS digital twin manufacturing institute
The US government has issues a call for research institutes in semiconductor manufacturing and packaging.
The CHIPS for America Act allocates at least $200 million over five years for a CHIPS Manufacturing USA Institute to create the first digital twin institute for new semiconductor and advanced packaging manufacturing.
The manufacturing institute will focus on digital twins for semiconductor manufacturing, packaging, and assembly and the validation of such digital twins in a physical prototyping facility.
IT also includes advance digital twin-enabled training for the semiconductor workforce nationwide and the creation of a digital twin marketplace for industry, including entrepreneurs, to access digital models and manufacturing process flows and to de-risk digital twin development and implementation. Siemens is already working with Intel on a digital twin of its fabs and ST has built one for its fab in Crolles, France what will also be used by partner Global Foundries.
- ST builds digital twin of Crolles fab
- Intel signs Siemens for digital twin fab digitalisation
- Synopsys looks to SoC digital twins with 30bn gates of emulation
This is part of the $11 billion allocated for semiconductor R&D in the US under the act, alongside incentives for chip makers to builds fabs.
Alongside the digital twin manufacturing institute, the US Department of Commerce also announce a competition for new R&D activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for packaging semiconductors.
The CHIPS for America programme anticipates awarding approximately $300 million in funding for multiple projects in substrates and substrate materials research.
The National Advanced Packaging Manufacturing Program (NAPMP) will invest a total $3 billion in programs that include an advanced packaging piloting facility for validate and bring new technologies to US manufacturers, as well as workforce training programs to ensure that new processes and tools are capably staffed and funding for projects.
- Amkor looks to EU CHIPS Act for semiconductor packaging
- International Semiconductor Alliance launches for packaging
The competitions are run by the National Institute for Standards and Technology (NIST)
www.federalregister.gov/documents/2024/02/01/2024-02025/chips-manufacturing-usa-institute
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