Vapour phase solder support for process profiling
A small form factor data logger is installed inside the shield to capture profile information from the circuit board being processed; information can also be relayed in real-time to the use via a 2.4GHz telemetry link. For the quick preparation of a test, thermocouple connectors are fitted to the outside of the barrier. After each run through the machine, the barrier can be opened and the data logger easily removed; this approach provides faster cool down cycles and reduced possibility of damage to the data logger unit. The software supplied with the system has additional support for definition of the vapour phase process allowing engineer to quickly establish the optimum settings for a given assembly.
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