Vicor opens first “ChiP” fabrication facility 

Vicor opens first “ChiP” fabrication facility 

Business news |
By Jean-Pierre Joosting

Vicor has opened its new, state-of-the-art power module manufacturing facility, the world’s first ChiP™ (Converter housed in Package) fabrication facility that enables the most scalable, automated, cost-effective manufacturing of power modules to support customers worldwide. The ChiP facility comes online as Vicor celebrates 41 years of expanding its performance leadership within the global power electronics industry with U.S.-based manufacturing.

With its new ChiP foundry, Vicor takes a major step toward realizing its vision to enable high-performance, modular power products capable of satisfying demanding power requirements across a range of high-growth markets. The new, vertically-integrated ChiP fab utilizes patented fabrication processes that further differentiate Vicor power modules by enabling the most power-dense and energy efficient solutions in the industry.

“Our new ChiP fabrication facility is designed with our customers in mind. This one-of-a-kind, facility will increase production capabilities, enabling Vicor to continue supporting its major growth markets across Europe,” said Henryk Dabrowski, Vice President, Sales, EMEA, Vicor. “Customers choose Vicor to help them overcome their space, weight, efficiency, or thermal constraints when designing power delivery networks. The new facility has increased manufacturing floor space by 45% and we expect the increased production potential to support our European growth markets, such as satellite, automotive electrification and high performance computing.

ChiP™ technology was developed to maximize power module density and thermal performance. These packages are distinguished by their two-sided component assembly while being cut from fixed-size panels, similar to how silicon chips are made and cut from wafers. By using ChiP technology, a faster time to market and a higher level of performance predictability can be achieved in new power module designs.


Further reading

InnovationLab acquires flexible printed battery technology
Renesas to reopen 300-mm power semiconductors fab
Integrated and scalable wireless charging platform

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