
The TCM5126GBA integrates a high dynamic range (HDR) function that reproduces high quality images of objects backlit by the sun and vehicle headlights. The product has a chip-scale package (CSP) that uses through-silicon via (TSV) technology to reduce the component size by 30 percent against equivalent products, Toshiba claims. The package size is 6.78mm by 6.33mm.
The sensor captures video at 60 frames per second and has 648 by 486 pixels on a 5.6-micron pitch. Output comes in a variety of formats including 10- and 12-bit RAW, YUV422, RGB565 and RGB888.
The sensor is suitable not only for conventional back-view camera but also surround-view camera – a bird’s eye view – and side-view cameras. The TCM5126GBA operates from a single 3.3-V power supply.
The sensor has a variety of integrated functions supporting rear view camera systems including: picture flip, on-screen display, zoom, timer and stand-alone operation support.
Sample shipments of the TCM5126GBA are currently available. Mass production is scheduled to start in 2Q14.
Related links and articles:
https://www.semicon.toshiba.co.jp/eng/
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