Vincotech renews power module deal with Semikron Danfoss.
Vincotech in Germany has renewed its power packaging deal with Semikron Danfoss.
The move reinforces the use of the MiniSKiiP power module by Vincotech and Semikron Danfoss which have been working on the package technology since 2003. The two companies are now working on the next generation technology.
The MiniSKiiP power module package technology is designed for easy assembly with service-friendly spring contacts. The extension support multiple source options for the package to further mitigate the supply chain risk alongside a standards-compliant design.
“We are delighted to be renewing our partnership with Semikron Danfoss for the MiniSKiiP package technology,” said Edoardo Guiotto, VP Sales & Marketing at Vincotech. “This agreement reaffirms our dedication to deliver premium products to our customers and drive innovation and advances in power electronics.”
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“The partnership with Vincotech is key to ensuring the safe supply of our number one motor drive module MiniSKiiP to our customers,” said Peter Sontheimer, Senior Vice President Industry Division at Semikron Danfoss. “We strongly believe that this type of arrangement is beneficial to the long-term health of the power electronics supply chain.”
Vincotech and Semikron Danfoss are working on the reliability and standardization of MiniSKiiP for the next generation with greater robustness, versatility, and compatibility for power electronics.
www.vincotech.com; www.semikron-danfoss.com.
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