Virtual fabrication platform provides statistical insight into process variation challenges
Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within the SEMulator3D process-predictive platform.
In semiconductor device fabrication, the various processing steps have grown increasingly complex as smaller semiconductor feature sizes and nodes are developed. With shrinking process technologies, variability in unit process behavior can have a significant impact on device structure, device performance, defect modes and ultimate yield. SEMulator3D Analytics automates statistical analysis of process variation so that users can better understand the potential impact of statistical process variation on device performance and yield. The new Analytics user interface guides users in the design, execution and analysis of large statistical experiments using various techniques, including Monte-Carlo process analysis. SEMulator3D 6.1 enables accurate modeling and performance prediction for next-generation processes including FinFETs, 3D NAND Flash, BEOL, Nanowires, 3D-IC, FDSOI, and DRAM.
Novel process modeling capabilities include complex sidewall patterns, using a flexible “Profile Sweep” function that allows users to create complex, 3D sidewall, resist and etch profiles. A new etch model captures heterogeneous crystalline/amorphous etches and a new lithography model captures more realistic on-chip feature patterns.
Coventor – www.coventor.com
