Virtual fabrication software increases semi process modelling accuracy
This version further increases the accuracy of the process simulation, geometry and modelling of advanced semiconductor processes with new features and usability enhancements. Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within the SEMulator3D process-predictive platform.
In semiconductor device fabrication, Coventor notes, the various processing steps have grown increasingly complex as smaller semiconductor feature sizes and nodes are developed. With shrinking process technologies, variability in unit process behaviour can have a significant impact on device structure, device performance, defect modes and ultimate yield. SEMulator3D Analytics automates statistical analysis of process variation so that users can better understand the potential impact of statistical process variation on device performance and yield. The new Analytics user interface guides users in the design, execution and analysis of large statistical experiments using various techniques, including Monte-Carlo process analysis.
“The real break-through here is our ability to drive technology yield ramp actions [i.e. adjustment made to process detail to maximise yield of operational devices] by optimizing process steps and process variation in a statistical environment. Important process parameters can be statistically analyzed to identify areas of concern with structural measurements, yield checks and electrical specifications” said David Fried, CTO of Coventor. “Now, our users can automate the large statistical design of experiments (DOEs) for virtual fabrication, to minimize critical defects and maximize device performance and yield.”
SEMulator3D 6.1 enables accurate modelling and performance prediction for next-generation processes including FinFETs, 3D NAND Flash, BEOL, Nanowires, 3D-IC, FDSOI, and DRAM.
The new version of SEMulator3D features several new process modelling capabilities, including:
Complex sidewall patterns can now be made using a flexible “Profile Sweep” function. This new feature can be used to quickly create complex, 3D sidewall, resist and etch profiles.
A new etch model captures heterogeneous crystalline/amorphous etches
A new lithography model captures more realistic on-chip feature patterns
SEMulator3D 6.1 also features a new unified user-interface, with all major software components captured within a single application window, and a process file locking and encryption system which allows customers to control access to their sensitive process data.
Coventor; www.coventor.com
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