VR boost with 360° 5G module
Swedish chip developer Sivers Semiconductors has teamed up with Kreemo in Korea on a high performance 5G module with 360° coverage for virtual reality and the metaverse
The module combines the Sivers Semiconductors 28GHz Beamforming integrated circuit, the Summit2629, and Kreemo’s 360° antenna technology. This has two antennas are stacked on top of each other, providing 360° coverage and dual-polarization by controlling the direction of the current.
The low power 5G module can smoothly transmit and receive high-frequency signals in any direction at 360°. This eliminates shadow areas and maximizes broadband high-capacity transmission and reception for moving around VR worlds.
The module was launched at Mobile World Congress in Barcelona, Spain, and samples will be available from Q2, 2022.
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“Kreemo has developed this module in record time. With this 5G module optimized for the metaverse, Sivers Semiconductors enters for the first time into consumer applications. We are looking forward to work with Kreemo on multiple projects going forward,” says Anders Storm, Group CEO of Sivers Semiconductors.
“Through the development of this module, we plan to take the lead in the market by providing 5G devices and infrastructure solutions for metaverse services. We will continue to work together to create more innovative products using Sivers Semiconductors BFICs and Kreemo’s 360° antenna technology,” said John Park, CEO of Kreemo, which is also supplying various products along with AoD (Antenna-on-Display) for smartphones, wearable devices, AR/smart glasses and smart TVs.
www.sivers-semiconductors.com; https://www.kreemo.io
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