VSMC breaks ground on 300mm Singapore fab
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VisionPower Semiconductor Manufacturing Company (VSMC) has started building its 300mm wafer manufacturing facility in Tampines, Singapore.
VSMC is a joint venture between Vanguard International Semiconductor (VIS) NXP Semiconductors to
The fab, with a $7.8bn investment. will adopt a fully automated production model, integrating an Automated Material Handling System (AMHS) and comprehensive quality management through Artificial Intelligence applications. It is expected to start production in 2027 using legacy process technology from TSMC to provide a second course supply.
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“Singapore is renowned not only as Asia’s economic hub but also as a beacon of technological innovation. We are proud to announce the groundbreaking of our first 12-inch fab in Singapore, which will uphold the company’s core business philosophy, provide specialty IC foundry services, and lay the foundation for our future development. This fab will advance the semiconductor industry and bolster the local high-tech sector,” said VSMC and VIS Chairman Leuh Fang. “Designed with modern technology and guided by green manufacturing principles, the fab reflects our firm commitment to the future. VSMC is dedicated to being a responsible corporate citizen, supporting economic growth while ensuring environmental sustainability.”
“I’m humbled and excited to see construction of VSMC’s 300mm fab moving forward very swiftly,” said NXP President and CEO Kurt Sievers. “NXP has enjoyed decades of successful semiconductor manufacturing operations in Singapore, and the new VSMC fab is entirely aligned with our differentiated hybrid manufacturing strategy. This new fab will support NXP’s growth plans with supply control and geographic resilience at competitive cost.”
“We welcome the decision by VIS and NXP to jointly establish VSMC and its greenfield 12-inch wafer fab in Singapore. This is testament to Singapore’s attractiveness to global companies to site advanced manufacturing activities, and reinforces Singapore’s position as a critical global node in the semiconductor supply chain. The new fab will not only create about 1,500 good jobs, it will also facilitate business and partnership opportunities for local enterprises,” said Ms Cindy Koh, Executive Vice President, Singapore Economic Development Board. “Singapore will continue to invest in talent development, R&D, and decarbonization solutions to enhance our competitiveness and strengthen Singapore’s semiconductor ecosystem.”
The groundbreaking ceremony was attended by customers, suppliers, partners, association representatives, residents, and government officials.
Upon the successful ramp of the initial phase, a second phase will be considered and developed pending future business development by VIS and NXP. With an expected output of 55,000 300mm wafers per month in 2029, the joint venture will create approximately 1,500 jobs
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