WeEn Semiconductors plans 1400V IGBT, launches 1200V
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WeEn Semiconductors, a power spinout from NXP, has launched a range of 650V and 1200V IGBTs and is planning a 1400V version.
The 1200V IGBT devices launched at PCIM this week are based on a fine trench gate field-stop (FS) technology for a more uniform electric field within the chip, support higher breakdown voltages and offer improved dynamic control. By offering the optimum trade-off between conduction and switching losses, as well as an enhanced EMI design, the devices will maximize efficiency in a wide variety of mid- to high-switching-frequency power conversion designs.
These are the third generation IGBT and modules, and the company is working on a 1400V version, CEO Markus Mosen tells eeNews Europe.
The 1200V IGBT devices offer ratings of 650V/75A, 1200V/40A and 1200V/75A and are supplied in TO247 or TO247-4L packages depending on the selected device. All of the devices will operate with a maximum junction temperature (Tj) of 175 °C and have undergone high-voltage H3TRB (high-humidity, high-temperature and high-voltage reverse bias) and 100%-biased HTRB (high-temperature reverse bias) tests up to this maximum.
Target applications include solar inverters, motor control systems, uninterruptible power supplies (UPS) and welding. A positive temperature coefficient simplifies parallel operation in applications where higher performance is required, while options for bare die, discrete and module product variants provide flexibility for a wide variety of target designs.
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