MENU

Western Digital doubles 3D-NAND capacity

Technology News |
By Peter Clarke


Western Digital introduced a 256Gbit 3D-NAND flash memory in July 2016 (see Western Digital claims first 64-layer 3D NAND memory). Like that chip the latest model uses 64-layers and three-bits-per-cell implemented in Toshiba’s BICS3 technology.

Western Digital is presenting a technical paper the high aspect ratio semiconductor processing that allows 3D-NAND at the International Solid State Circuits Conference (ISSCC) in San Francisco.

Related links and articles:

www.wdc.com

www.toshiba.com

www.isscc.org

News articles:

Western Digital says 3D ReRAM ready for storage

Western Digital claims first 64-layer 3D NAND memory

China-backed Western Digital swoops on SanDisk

Dual layer helps ReRAM reach mainstream capacity

Is 3D XPoint based on phase-change memory?


Share:

Linked Articles
eeNews Europe
10s