
Western Digital introduced a 256Gbit 3D-NAND flash memory in July 2016 (see Western Digital claims first 64-layer 3D NAND memory). Like that chip the latest model uses 64-layers and three-bits-per-cell implemented in Toshiba’s BICS3 technology.
Western Digital is presenting a technical paper the high aspect ratio semiconductor processing that allows 3D-NAND at the International Solid State Circuits Conference (ISSCC) in San Francisco.
Related links and articles:
News articles:
Western Digital says 3D ReRAM ready for storage
Western Digital claims first 64-layer 3D NAND memory
China-backed Western Digital swoops on SanDisk
Dual layer helps ReRAM reach mainstream capacity
Is 3D XPoint based on phase-change memory?
