Wettable MOSFETs boost reliability in ADAS systems
The RV4xxx series is AEC-Q101 qualified in a DFN1616 package, ensuring automotive-grade reliability and performance under extreme conditions.
In recent years, the growing number of vehicle safety and convenience systems such as ADAS cameras has emphasized the challenge of limited space to accommodate these systems and spurring the demand for smaller components.
The larger currents required by high resolution cameras in advanced vehicle systems is driving the use of MOSFETs that provide low ON resistance and less heat generation. For example, at a current and power consumption of 2.0A and 0.6W, respectively, conventional automotive MOSFETs can reduce mounting area by 30% over diodes. However, adopting bottom electrode MOSFETs capable of providing excellent heat dissipation while still supporting large currents in an even smaller form factor makes it possible to decrease mounting area by as much as 78% compared with conventional SBDs and by as much as 68% compared with conventional MOSFETs.
To meet this need, bottom electrode type MOSFETs that can be miniaturized while maintaining high current are increasingly attracting attention. However, for automotive applications optical inspection is performed during the assembly process to ensure quality, but in the case of bottom electrode components solder height cannot be verified after mounting, making it difficult to confirm mounting conditions.
The newly developed packaging technique ensures that the electrode height on the side of the package (130µm) required for vehicle applications by using original Wettable Flank formation technology. The result is a consistent solder quality – even for bottom electrode type products – enabling automatic inspection machines to easily verify solder conditions after mounting. This involves making a cut into the lead frame on the side of the package before plating. However, burrs resulting from cutting into the lead frame can occur more frequently as the height of the cut increases, so another technique introduces a barrier layer on the entire surface of the lead frame to minimize the occurrence of burrs.
Samples are available now with production in September 2019.
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