Next-gen silicon microdevices: key technologies and fabrication


This white paper catalogues some of the key technologies and fabrication processes for next-generation microdevices that are being researched at IMEC. These include 3D integration, silicon photonics, microfluidics, and the integration of exotic materials in a CMOS process flow. Each topic includes at least one case of an advanced application and its challenges. The final chapter switches from a purely technical to an economic perspective to describe how an early focus on manufacturability can result in a shorter time to market.

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