
IHS Markit predicts that the market for Wi-Fi devices in low-power IoT end-node applications is forecast to grow from 128 million units per year in 2016 to 584 million units per year by 2021.
The WF200 transceiver and WFM200 module are intended to assist developers getting smaller products to market faster. The WFM200 system-in-package (SiP) module is a small (6.5 mm x 6.5 mm LGA52), pre-certified module with an integrated antenna. The WF200 transceiver comes in a 4 mm x 4 mm QFN32 package, provides developers with additional flexibility and is mainly intended for large volume applications.
The WF200 and WFM200 feature low transmit (138 mA) and receive (48 mA) power, 200 µA average Wi-Fi power consumption and a link budget of 115 dBm, as well as advanced security technology. The two devices are pre-certified by the FCC, CE, IC, South Korea and Japan to minimise development time. Development tools and a wireless starter kit are available, including embedded and Linux host drivers, for an even quicker start to development.
More information
www.silabs.com/low-power-wi-fi
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