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Wideband plastic packaged and bare die GaAs MMICs from DC to 27 GHz

Wideband plastic packaged and bare die GaAs MMICs from DC to 27 GHz

New Products |
By Jean-Pierre Joosting



These products add to a growing portfolio of high performance wideband MMICs and include four plastic packaged low noise amplifiers (LNAs), MMA040PP5, MMA041PP5, MMA043PP4 and MMA044PP3; a wideband power amplifier (PA) chip, MMA053AA; and two plastic packaged switches, MMS006PP3 and MMS008PP3.

The new packaged amplifiers include two new distributed LNAs (MMA040PP5 and MMA041PP5) which outperform competitive parts over a wider frequency from DC to 27 GHz with higher gain of 17 dB and OIP3 of 35 dBm. They are packaged in a small 5 mm plastic QFN package ideal for size constrained applications. Two additional wideband LNAs (MMA043PP4 and MMA044PP3) provide exceptionally low noise figure (NF) from 0.5 to 18 GHz with typical NF below 2 dB and no more than 2.5 dB at the band edge.

Two new wideband GaAs switches (MMS006PP3 and MMS008PPS) have improved insertion loss and isolation over a wider frequency range from DC to 20 Ghz when compared to competitive parts. These are housed in 3 mm plastic QFN packages which are ideal for high performance requirements in constrained size applications. The devices require minimal off-chip logic to control simplifying system level integration.

A wideband PA chip (MMA053AA) was also released which maintains flat gain of 17 dB and high OIP3 of 35 dBm from DC to 8 GHz, exceeding the performance of competitive parts. Offering superior pricing, customers can leverage all these devices’ leading performance capabilities to meet demanding system and module line-up requirements with minimal DC power consumption.

www.microsemi.com

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