Winbond, Infineon team on double bandwidth HyperRAM for IoT

Winbond, Infineon team on double bandwidth HyperRAM for IoT

Business news |
By Nick Flaherty

Winbond Electronics and Infineon Technologies have teamed up on the third generation of high bandwidth memories for the Internet of Things (IoT)

The HyperRAM range offers compact alternatives to traditional pseudo-SRAM and is well-suited to low power, space-constrained IoT applications that require an off-chip external RAM. HyperRAM 3.0 operates at a maximum frequency of 200MHz with a 1.8V operation voltage. This is the same as both HyperRAM 2.0 and OCTAL xSPI RAM, but with an increased data-transfer rate of 800Mbit/s, double the rate that was previously available through an expanded 16bit HyperBus I/O interface with 22 pins.

Introduced by Infineon (then Cypress) in 2015, HyperRAM has a broad ecosystem support from leading MCU, MPU and FPGA chipset partners and customers in power and board space-constrained applications requiring off-chip external RAM. Optimised HyperBus memory controllers are available from multiple third-party IP vendors. Winbond is a manufacturer of memory chip based in Taiwan.

“HyperRAM 3.0 is the third generation of the family that supports throughput of up to 800Mbit/s using a new 16-bit extended version of the HyperBus interface. The 256Mb HyperRAM 3.0 devices are now sampling. Infineon Technologies is pleased to collaborate with Winbond to enable broader adoption of this new memory technology,” said Ramesh Chettuvetty, Sr. Director of Marketing and Applications at Infineon Technologies.

“Low pin count, low power consumption and easy control are three key features of HyperRAM that help it significantly improve the performance of IoT end devices,” says Winbond. “HyperRAM significantly simplifies the PCB layout design, extends mobile devices’ battery life, and works with a smaller processer via a lower pin count while increasing throughput compared to low-power DRAM, SDRAM, and CRAM/PSRAM.”

The family is suitable for low-power IoT applications, such as wearables, instrument clusters in automotive applications, infotainment and telematics systems, industrial machine vision, HMI displays and communication modules.

The first member of the HyperRAM 3.0 family will be a 256Mb device in a known good die (KGD) WLCSP chip scale package which can be implemented at the component level, module level or PCB level based on the end product type.;

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