Winbond moves into HyperRAM® market
With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppliers are developing new-generation MCUs with higher performance and lower power consumption to meet the market demand. In addition, from the overall system design perspective, the RAM that works with the MCU also requires new options to provide better advantages than those of the existing SDRAM and pSRAM.
HyperRAM®, which supports the HyperBus® interface, is a new technical solution to address this demand. HyperBus® technology was first unveiled by Cypress in 2014, and the company launched its first HyperRAM® product in 2015. As the technology has been developed for many years and has a clear market position, Winbond Electronics has decided to join the HyperRAM® camp and launches 32Mb/64Mb/128Mb density products. This move will help Winbond further expand its product portfolio to respond to the diverse application needs, as well as make the ecosystem more complete through active participation.
More information and background at www.winbond.com
More eeNews information on HyperRAM can be found here https://www.eenewsembedded.com/search/node/hyperram
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :