Winbond QspiNAND flash developed for Qualcomm 9205 LTE modem
The 1.8V, 512Mbits (64Mega Bytes) QspiNAND flash has the correct density for designers using New Cellular NB-IoT Modules.
“As the Internet of Things expands to 50 billion connected devices by 2020, Quad SPI-NAND adoption rate may increase 4-5 fold within a few years,” said Alan Niebel, president of WebFeet Research, an independent market-research firm. “Winbond’s 1.8V QspiNAND Flash is suitable for both Automotive and IoT segments. NB-IoT is poised to grow in this new connected world with shipments that may reach 685M units worldwide by 2023”.
Winbond’s expansion from QSPI-NOR flash to QSPI-NAND flash is intended to provide users with the flexibility to choose the code storage feature-set that will suit the application best at low cost. The devices use the same 6-pin signals and QSPI command-set for SLC NAND flash densities without any detriment to performance by using the new Continuous READ feature at 104MHz Read Speed.
“Qualcomm Technologies has tested and qualified the Winbond QspiNAND flash as a stacked KGD solution with the Qualcomm 9205 LTE Modem, allowing our OEM customers to create extremely small form factor systems,” said Vieri Vanghi, vice president, product management, Qualcomm Europe Inc. “We are proud of our long-standing collaboration with Winbond, and look forward to continuing to provide leading IoT technology solutions together.”
W25N QspiNAND Flash family devices come in small 8-pin packages which has not been practical before for typical SLC NAND flash memory. W25N512GW is a 512M-bit memory array organized into 32,768 programmable pages of 2,112 bytes each. W25N512GW features a new Continuous Read mode that provides efficient access to the entire memory array with a single Read command that is ideal for code shadowing applications.
Clock speeds of 104MHz allow equivalent 416MHz (104MHz x 4) speed for Quad I/O performance when running with the Fast Read Dual/Quad I/O instructions. To provide better NAND Flash memory manageability, an on-chip feature is provided to perform bad block management.
“Expanding the SpiFlash family to include QspiNAND Flash will benefit the NOR market and SLC NAND Flash conversion from both QSPI-NOR Flash and Parallel NAND Flash,” said J.W. Park, Technology Executive of Winbond Flash Memory. “Winbond jointly-developed this new 512Mb QspiNAND Flash with Baseband Engineering-Team in delivering high performance with cost-benefit in mind.”
More information
www.winbond.com
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