Wireless smart packaging based on Thin Film printed electronics
Under the agreement with Bemis, Thinfilm will extend its work on a time-temperature sensor for use in monitoring perishable goods and pharmaceuticals. The result, due to be commercially available in 2014, will be packaging that can collect and wirelessly communicate sensor information, for use by leading food, consumer products and healthcare companies worldwide, Thin Film said.
"Our agreement with Thin Film represents an investment in a technology that could eventually make printed electronics a component of every package we manufacture," said Henry Theisen, CEO of Bemis, in a statement issued by Thin Film.
The flexible packaging market in North America is estimated to be worth $18.3 billion annually.
Mock up of RF sensor and tag for monitoring and reporting food freshness. Source: Thin Film Electronics.
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