World’s smallest LTE-M/NB-IoT SiP solution
Wireless semiconductor company Skyworks and cellular IoT solutions provider Sequans have introduced a 5G Massive IoT SiP (system-in-package) solution. The SKY66431 next-generation SiP combines Sequans’ Monarch 2 modem with Skyworks’ RF front-end solution, creating what is being offered as the world’s smallest LTE-M/NB-IoT connectivity platform in a single package.
Designed to address the increasing demand for form-factor driven cellular LPWAN end points, the SKY66431 is ideally suited for utility meters, asset trackers, security and alert systems and other battery-powered devices such as wearable medical and fleet management.
“As modern connected devices evolve, Skyworks’ extensive expertise within this market and advanced packaging technologies allow us to drive improvements in power consumption, size and advanced connectivity features to meet the rigorous performance requirements of our customers,” says Stefan Fulga, senior director of marketing for IoT and emerging products at Skyworks. “The SKY66431 SiP enables simplified, yet high performance designs that operate reliably worldwide, accelerating time-to-market for our customers.”
Georges Karam, Sequans’ CEO adds, “The new SKY66431 SiP is a compelling IoT connectivity solution. It is a comprehensive, all-in-one platform combining the technologies of two industry leaders who have included all of the critical components needed in one powerful, tiny SiP that is ideal for a wide range of IoT applications, from wearables, including medical devices and trackers, to sophisticated smart utility meters, requiring advanced packaging and capabilities.”
The SKY66431 is a highly integrated multi-band, multi-chip SiP supporting 5G Massive IoT platforms, offering high performance connectivity with ultra-low power consumption. Its native 23 dBm front-end module leverages Skyworks’ RF design and advanced packaging expertise that optimizes reliability in demanding environments and allows for extremely small footprint designs while maintaining simplified PCB design rules.
With SiP form factor-enabling miniaturization and fully encapsulated silver-free conformal shielding, say the companies, the SKY66431 package is a key differentiator enabling ultra-compact, flexible and robust end-product designs. The SKY66431 is being certified by a number of industry and regulatory agencies, as well as multiple network operators. This SiP is available now for select customers, with general availability expected in the first quarter of 2023.
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