X-Fab expands capacity for automotive semiconductors

X-Fab expands capacity for automotive semiconductors

Business news |
By Christoph Hammerschmidt

This is a major step in X-Fab’s plan to offer dual sourcing for all its 180nm processes (in both CMOS and SOI) – so that continuity of supply is always assured.

Located in Corbeil-Essonnes, just outside Paris, this manufacturing plant is the X-Fab’s largest in Europe. It has 15,000m²  of used cleanroom area, with additional 9,000m²  cleanroom space that can be equipped for future demand. The high-voltage XH018 technology now made available complements the RF-SOI technology already in production at that site for many years. 

Specifically optimized for automotive, industrial and medical applications, the XH018 mixed-signal process has a modular architecture that delivers maximum customer flexibility. Besides supporting high-temperature and low leakage operation, XH018 comes with advanced PDK features to improve the design robustness and enables first-time-right functional silicon. The offering includes advanced digital memory IP optimized for power, performance and area as well as analog/mixed-signal reference design kits and tools for checking operating conditions and ESD robustness.
Starting now, X-Fab France is accepting XH018 tape-ins for automotive applications. 

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