X-Fab teams for InP-on-silicon optical transceiver chiplets
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X-FAB Silicon Foundries is working with SMART Photonics and Epiphany Design to use Micro-Transfer-Printing for high-speed, energy-efficient optical transceiver chiplets
The three are developing a European collaborative platform that combines Indium Phosphide (InP) chiplets made by Smart Photonics with SOI chips from X-Fab via Micro-Transfer-Printing for multi-tera bit data rates for datacom and telecom applications.
MTP technology, pioneered by X-Celeprint, provides a broad degree of freedom for the system and product designers, by allowing flexible integration of chiplets into the product design.
The collaboration has developed a design flow and PDK that enables the design of photonics circuits integrating InP chiplets on an SOI platform. This collaboration upon the PhotonixFAB EU project, which supports the development of industrial pilot lines for silicon photonics SOI, micro-transfer print ready InP chiplets and MTP of InP chiplets on SOI and SiN photonics wafers.
The design flow is implemented in Luceda’s IPKISS EDA tool. Luceda’s technical expertise and support enabled the design of the demonstrator.
As part of this development, X-fab partner Epiphany Design has successfully demonstrated the new heterogeneous InP-on-SOI design flow with an optical transceiver demonstrator.
“By bringing together the integration density of silicon with the high performance of InP actives, we enable new possibilities for disruptive innovation in telecom, datacom, and beyond. This approach empowers PIC designers with greater flexibility and a clear path towards scalable, high-performance PIC-based solution,” said Jörn Epping, CEO of Epiphany Design.
The complete design flow will be available for early access in the first quarter of 2026. The goal is to support lead customers industrial prototyping by mid-2026, with production ramp-up readiness in 2027.
www.xfab.com; www.smartphotonics.nl; www.epiphany-design.com
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