XMC ships stacked BSI image sensors

XMC ships stacked BSI image sensors

Business news |
By eeNews Europe

All of those shipped are high end products with resolutions ranging from 5-megapixels to 23-megapixels manufactured using wafer bonding technology. In addition XMC has entered into volume production using 3D wafer stacking technology.

The R&D of wafer-level BSI technology started in the second half of 2012 with an an unnamed partner company and reached mass production at the beginning of 2014. At the beginning of 2015 XMC started mass production of 3D wafer stacking, based on the BSI technology. It is a wafer stacking technology that not only bonds two functional wafers of different process technologies, but also establishes the electrical connection between the two different chips in the bonded wafers.

"We will further enhance our 3D IC expertise on the basis of 3D wafer stacking technology, by which we can achieve high performance and low power through directly connecting the core parts of two chips. 3D IC is expected to be an important technology to keep us on track with Moore’s Law. It is also the key strength for XMC to establish its leadership in 3D IC industry," said Shaoning Mei, CTO at XMC, in a statement.

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