Zen Semi breaks ground on 300mm MEMS wafer fab

Zen Semi breaks ground on 300mm MEMS wafer fab

Business news |
By Peter Clarke

Guangzhou Zen Semiconductor Corporation (Guangzhou, China), known as Zensemi, has broken ground for the construction of a 300mm wafer fab for the manufacture of MEMS and other ICs, according a Digitimes report.

Digitimes referenced unnamed Chinese industry sources.

According to a Chinese jobs listing site Zen Semiconductor has been formed by Guangzhou Great Bay intelligent sensor industry group, and is sponsored by Shanghai Sirui Technology Co. Ltd., SIMIC Holdings Co. Ltd and other technical enterprises.

The main products from the fab will be mechanical, acoustic, microfluidic, biological and other MEMS-based sensors together with support for ASIC chips. There is a plan to invest 7 billion yuan (about US$1 billion) in the first phase of establishing the fab, according to the listing.

MEMS market leader Bosch is only just moving towards 300mm wafer production, with the bulk of its production on 200mm wafers. Bosch has plans to spend €3 billion on expanding production (about US$3 billion), albeit across multiple fabs between now and 2026 and across both MEMS and IC manufacturing.

Related links and articles:

Bosch leads vendor ranking in strong MEMS market

Bosch to spend €3bn on European fabs

MEMS foundry Atomica raises $30 million

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