PCB design software vendor Zuken Ltd. (Bristol, England) has announced enhanced support for power module design that has been developed with the Compound Semiconductor Applications Catapult in South Wales.
CSA Catapult is a UK government funded non-profit organization founded to help the UK become a global leader in compound semiconductors. CSA Catapult has been working with Zuken on how to make power module design 3D rather than 2D.
CSA Catapult has identified requirements and optimizations within Zuken’s CR-8000 Design Force chip, package and PCB co-design software that will provide designers of power electronic products with the ability to co-develop mechanical and electrical design in unison. Integration with simulation tools allows design iteration.
As a result of the collaboration a function has been added to CR-8000 to generate interconnections between chips and copper layers in a substrate or a printed circuit board, as well as a function to export a CAD model in a format compatible with finite element modelling (FEM) software. These features help designers to generate a 3D model of the power module substrate, chip layout, and chip-to-chip as well as chip-to-copper interconnections.
The capability is included in the 2022 release of CR-8000 Design Force.