The VCS native integration with Synopsys Verification IP and Verdi advanced debug solutions enables design teams to achieve higher productivity for accelerated verification closure with superior hardware price/performance.
"AWS has been an early adopter of Synopsys' functional verification solutions to accelerate the development of our next-generation datacentre chips," said David Brown, Vice President of Amazon ECS. "Using Synopsys verification tools on AWS Graviton2 allows us to perform full chip simulation at lower cost."
"As SoC design complexity grows, so do the number of simulation cycles they require, which increases the demand for more compute power," said Sandeep Mehrotra, VP of engineering in the Verification Group at Synopsys. "Our verification technology collaboration enabled AWS to perform full-chip simulation for their datacentre SoCs and find bugs faster. With VCS optimized for multi-core and many-core Arm-based CPU platforms to the cloud, users are able to move simulation workloads to the cloud, enabling faster time-to-market."
This follows Cadence completely re-architecting its simulation and analysis tools with a technology it calls Cloudburst.
“Why this is the right time is the fact that Cloudburst which really is the answer for EMI testing without spending the money on a chamber with a 500 core simulator,” said Brad Griffin, Product Management Group Director, Multi-Physics System Analysis at the Cadence Custom IC & PCB Group. “We can set all the software up running in an environment where everything is running properly and customers can log in and use the cloud for how many cores to use to get the simulation results back. This gives the same results as if you bult a prototype and put it in a test chamber,” he said.
Mentor, now Siemens EDA, has also been moving to the cloud for its EDA tools to combine with . Working with ST Microelectronics, it is working to accelerate the characterisation of libraries, scaling up its cloud processing to reduce the time taken from weeks to hours.
But this move to the cloud is also about adding new capabilities, particularly machine learning, as the Mentor/ST project also shows.
This ability to add in other capabilities such as machine learning means the hybrid cloud is set to go the way of the workstation. There will still be a need for local processing, particularly for low latency design flows such as physical emulation on FPGAs, but even this is moving into the cloud.
But the cloud is more than just accelerating point tools in an EDA flow. Siemens has been pushing the idea of the digital twin as the heart of the complete design process, from chip to software to end system.
“When we first started talking about digital twins the reaction was we simulate designs all the time. That’s part of what enables a digital but there’s not just the digital twin of the design but of the manufacturing process and the way the device is used that provides feedback,” said Joe Sawicki at Siemens EDA
Infineon is using the digital twin technology for chip design for automotive designs,
“What is changing is we are moving away from hardware boards, a lot of these things are done in simulation with online tools that allows people to be faster with early prototyping,” said Hans Adlkofer, Senior Vice President Automotive System Group at Infineon Technologies. “What is more and more of a challenge for developers is the software
ARM has already used the technology to model an entire car.
“The digital twin is not just useful in autonomous vehicles,” said Sawicki. “In 5G we are looking to model the behaviour of the edge and combine that with the cell tower, the channel and the interface up to the cloud so we can model the entire stack and look at how the 5G applications will perform.”
This of course brings challenges further down the tool chain, particularly in verification and validation