This collaboration complements ams strategic approach to further broaden its portfolio for all three 3D technologies Active Stereo Vision (ASV), Time-of-Flight (ToF) and Structured Light (SL) while accelerating time to market for a more differentiated set of new products. Initially, the partners will focus on the development of 3D Near Infrared (NIR) sensors for facial recognition and applications requiring a high Quantum Efficiency (QE) in the NIR range (2D and 3D).
To speed up the time to market for customers, the companies will collaborate on the development of a 3D ASV reference design to support the planned future launch of a 1.3MP Stacked BSI Global Shutter Image Sensor with state of the art QE up to 40% at 940nm. The reference design will enable high performance depth maps for payment, face recognition and AR/VR applications at a highly competitive total system cost.
This collaboration is expected to bring ams customers the benefit of a faster time to market for 3D Active Stereo Vision and Structured Light applications in mobile phones and other devices including IoT applications, based on ams’ 3D technology and core IP on Voltage-Domain Global Shutter. It will also help accelerate time to market for new automotive applications such as in-cabin 2D and 3D sensing.
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