Baidu and Samsung Electronics partner on 14nm AI chip: Page 2 of 2

December 23, 2019 //By
14nm AI chip
Designed based on Samsung’s 14nm process and I-Cube package technology, Baidu’s first cloud-to-edge AI accelerator, KUNLUN, has completed its development and will be mass-produced early next year.

“We are excited to start a new foundry service for Baidu using our 14nm process technology,” said Ryan Lee, vice president of Foundry Marketing at Samsung Electronics. “Baidu KUNLUN is an important milestone for Samsung Foundry as we’re expanding our business area beyond mobile to datacenter applications by developing and mass-producing AI chips. Samsung will provide comprehensive foundry solutions from design support to cutting-edge manufacturing technologies, such as 5LPE, 4LPE, as well as 2.5D packaging.”

Samsung’s I-Cube technology, which connects a logic chip and high bandwidth memory with an interposer, provides higher density/ bandwidth on minimum size by utilizing Samsung’s differentiated solutions.

Compared to previous technology, these solutions maximize product performance with more than 50% improved power/signal integrity. It is anticipated that I-Cube technology will mark a new epoch in the heterogeneous computing market. Samsung is also developing more advanced packaging technologies, such as redistribution layers (RDL) interposer and 4x, 8x HBM integrated package.

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