Ball-attach flux for LED die attach

September 09, 2020 //By Nick Flaherty
The WS-829 ball-attach flux from Indium can be used for the smallest ball grid array packages and LED die attach applications
The WS-829 ball-attach flux from Indium can be used for the smallest ball grid array packages and LED die attach applications

Indium has launched a new ball-attach flux designed for printing and pin transfer applications for the smallest sphere and high-density applications, including LED die attach.

WS-829 is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard ball-grid array (BGA) manufacturing process. The flux is optimised for the smallest sphere applications below 0.25mm as well as die attach for wafer-/panel-level packaging (WLP/PLP).

The flux claims best-in-class flux residue cleanability when using only DI water. It also effectively cleans off contamination or pad oxidation from processes before ball mount. High tackiness holds the smallest solder spheres and LED die in place and reduces missing balls or die skew defects. The formulation of the WS-829 ensures consistent flux definition over long periods of time with minimal slump.

www.indium.com/ball-attach

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Picture: 
Ball grid array die attach

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