Bluetooth 5.0 LE module is only 9.0x9.5x1.8mm

November 25, 2019 //By Julien Happich
Panasonic Industry’s PAN1740A Bluetooth 5.0 module comes in a 9.0x9.5x1.8mm footprint and is rated for operation in the -40 to +85°C temperature range for IIot and smart home applications.

This optimized version offers a quicker boot time and supports up to eight connections to allow greater flexibility to create more advanced applications. It can be used as a standalone application processor or as a data pump in hosted systems. The device is optimized for remote control units (RCU) requiring support for voice commands and motion/gesture recognition.
The Bluetooth Low Energy firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT) and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG as well as custom profiles are supported. The module is built around a Dialog DA14585 board and a ARM Cortex-M0 microcontroller, it runs from a 2.2V up to 3.3V supply voltage range.

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