Helix's patent-pending approach to capacitive isolation has been implemented in a capacitive isolation concept board using uses chips based on its MuxCapacitor technology on the primary and secondary sides.,
As an ever-growing number of electronic devices demand more power, new solutions are needed that offer higher power density, higher efficiency and significantly smaller form factors. Traditional power conversion approaches, such as transformer-based voltage reduction, just don’t cut it and a different approach is needed. By eliminating transformers and transferring power across a capacitive isolation barrier, transformerless AC-DC power supply products can be created that result in more than 10x power density improvement with average efficiencies greater than 94 percent.
These products will also have a significantly smaller footprint, making them ideal for potentially eliminating that bulky “brick” and integrating the power module into the appliance being powered.UL standards are recognized as some of the highest safety benchmarks in the world, and Helix Semiconductors’ concept board was reviewed for everything from SELV to touch current, overcurrent, overvoltage, and electric strength. “This represents a critical step in making transformerless chipsets a reality,” said Bud Courville, Helix Semiconductors VP of business development,
“Getting more power in less space is the industry mantra behind all mobile and IoT devices and is the key to further mobility enablement in a future with less energy waste,” said Harold Blomquist,president and CEO of Helix Semiconductors. “Helix Semiconductors is committed to this vision, and we are leading the demand for more energy-efficient power supplies in the burgeoning AC-DC and DC-DC markets. Passing UL testing is an important step for the future release of transformerless chipsets, such as our MxC 300, and assures customers that the path to transformer replacement is free of roadblocks.”