Chinese chiplet packaging startup raises $300m

October 08, 2021 // By Peter Clarke
China's chiplet packaging startup raises $300 million
Chiplet packaging sartup SJ Semiconductor has raised $300 million in a Series C round of finance.

The funding was provided by Walden CEL, CCB PE, CCB Trust, Growth, Country Garden Venture, HTPE and GP Capital, together with participation from existing investors Oriza Rivertown, CCIC Capital, Oriza Hua Capital.

SJ Semiconductor was founded in August 2014 and the last round of funding beings SJSemi's total amount raised to $630 million and its valuation to more than $1 billion.

SJSemi specializes in applying bumps to ICs on 300mm-diameter wafers and wafer-level packaging. The company started 28nm and 14nm bumping for smartphone processor chips in 2016 and provides bumping for DRAM and PMICs.

The company went through a restructuring in June 2021.

"The funding will help us to continue our growth plan, not only to expand bumping and WLCSP capacity, but also to increase RD investments to expedite our patented SmartPoser, a multi-die 3D integration platform, for manufacturability, to serve multi-die integration needs from emerging markets like HPC and high-end consumer electronics," said Dong Cui, chairman and CEO of the company, in a statement.

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