Chip scale packaging for ARM M23 IoT end point microcontrollers

October 13, 2021 // By Nick Flaherty
Chip scale packaging for IoT end point microcontroller range
Renesas has launched a range of 48MHz to 200MHz ARM M23 microcontrollers in chip scale packaging

The RA2E2 Group from Renesas Electronics is based on the latest ARM Cortex-M23 core with low power consumption, I3C peripherals for IoT endpoint applications and a 16-pin WLCSP (Wafer Level Chip Scale Package) measuring only 1.87 x 1.84 mm.

The RA2E2 Group MCUs are designed to address the needs of IoT endpoint applications, including wearables, medical devices, appliances and industrial automation. The operating power consumption is 81uA/MHz in active mode with a standby current of only 200nA with fast wakeup, which Renesas says is the lowest in its class.

The devices also support a wide temperature range of Ta = -40/+125°C for harsh IoT operating environments. The RA2E2 Group supports an I3C bus interface and integrates cost-saving peripheral functions, including an on-chip oscillator with precision of +/-1 percent, power on reset and low voltage detector, EEPROM, and a temperature sensor.

The RA Family includes over 160 parts ranging from 48MHz to 200MHz including a 24 pin QFN package.

All the RA devices are supported by the Renesas Flexible Software Program (FSP) that includes highly efficient drivers and middleware to ease the implementation of communications and security. The FSP’s GUI simplifies and accelerates the development process. It enables flexible use of legacy code as well as compatibility and scalability with other RA Family devices. Designers using FSP also have access to the Arm ecosystem.

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“We see increasing demand for 32-bit MCUs in low-pin-count IoT endpoint applications, and the RA2E2 Group addresses that market need with the right features and performance,” said Roger Wendelken, Senior Vice President in the IoT and Infrastructure Business Unit at Renesas. “Our RA family now offers solutions from 16- to 176-pins and from 48- to 200-MHz performance, all supported by our FSP that enables easy and fast transition of design IP between different devices.”

The RA2E2 Group includes nine different devices, spanning from 16-pin to 24-pin packages, and from 16KB to 64KB of flash memory along with 8KB of SRAM. The devices also include 2KB of data flash memory, a feature that other low-pin count devices don’t provide. They are also the only MCUs in their class to offer an I3C bus interface, delivering high-speed communications of 4.6 Mbps while significantly reducing power consumption. The RA2E2 Group includes ARM TrustZone security features as well, including a cryptography accelerator (AES256/128), a True Random Number Generator (TRNG) and memory protection units.

Renesas has combined the RA2E2 MCUs and other RA MCUs with complementary analog and power devices for a range of reference designs includes a DDR5 Gaming DIMM for addressable LED control.

The RA2E2 Group is available today along with the EK-RA2E2 Evaluation Kit.

renesas.com/RA2E2

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