COM Express module jumps to 11th gen Core processors

September 24, 2020 //By Nick Flaherty
Avnet Integrated's MSC C6C-TLU COM Express Type 6 module family is based on the 11th Generation Intel Core processors (Tiger Lake UP3)
Avnet Integrated's MSC C6C-TLU COM Express Type 6 module family is based on the 11th Generation Intel Core real time processors (Tiger Lake UP3)

Avnet Integrated has launched a COM Express Type 6 module family based on the 11th Generation 10nm Intel Core processors (Tiger Lake UP3).

The previous modules used the 8th generation processor, so the 10nm version gives a signficant boost in performance and reduction in power for deterministic Ethernet networks. Like Intel's other Elkhart Lake processors, the Tiger Lake UP3 two and four-core processors support Time-Sensitive Networking (TSN) and Intel Time Coordinated Computing (TCC) to meet stringent timing and low latency requirements under hard real-time conditions.

The processors feature a thermal design power (TDP) of between 12W and 28W and are available with fast LPDDR4X-4266 memory connected via two memory channels. The supported memory capacity can range from 4GB to 32GB. Especially for mission critical applications, an in-band error correcting code (ECC) option can be used to protect code and data kept in memory.

The MSC C6C-TLU COM Express module family can drive up to four independent displays with a maximum of 4k resolution. Three DisplayPort/HDMI interfaces and one LVDS and
Embedded DisplayPort interface are available as graphic interfaces. Fast I/Os includes up to nine PCIe Gen 3 lanes, four USB 3.1 interfaces and one Gigabit Ethernet port. Mass storage devices can be connected via two SATA 6Gb/s channels.

The rugged design allows the MSC C6C-TLU COM Express module to be used in harsh industrial conditions or outdoor installations. Avnet Integrated offers the module with industrial ambient temperature range of -40°C to +85°C and full 24/7 capability, based on 11th Gen Intel Core processor variants that are specified for extended operational conditions. The product family is highly resistant to shock and vibration as the memory devices are soldered to the board. Optionally, Avnet Integrated can provide the MSC C6C-TLU modules with conformal coating to reliably protect against environmental stress such as contaminants and moisture.

Developer can use Intel's Distribution of OpenVINO toolkit for high-end applications such as artificial intelligence (AI) and Industrial IoT (IIoT) based systems, high-performance medical devices, professional audio/video equipment, innovative control systems and intelligent camera solutions.


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