EE Times Silicon 60: 2016's Emerging Companies to Watch: Page 7 of 11

September 20, 2016 // By Peter Clarke
EE Times Silicon 60: 2016's Emerging Companies to Watch
EE Times introduces v17.1 of the Silicon 60 list of emerging companies.

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mCube Inc. (San Jose, Calif.) was founded in September 2009 and has developed a method for integrating MEMS motion sensors above electronic circuitry in a standard CMOS wafer fab using through-silicon via (TSV) connections. The process includes hermetic sealing of the assembly. The company claims that this provides an advantage in terms of sensor size that will help it with applications in wearable equipment and the Internet of things.

NetSpeed Systems Inc. (San Jose, Calif.) supplies on-chip network IPs to SoC designers for markets from mobile to high-performance computing and networking and developed through a system-level approach and user-driven automation. Founded in 2011.

Nextinput Inc. (Atlanta, Georgia) founded in 2012 as a spin-off from Georgia Tech to commercialize a force-sensitive touch technology developed by CEO and co-founder Ian Campbell. The company claims it can provide a tactile, force or pressure sensitive method of interfacing with virtually any electronic device. Steve Nasiri, founder of InvenSense, is on the board of directors, and Kurt Petersen serves on a technical advisory board.

Nikola Labs LLC (Columbus, Ohio) was founded in October 2014 in partnership with The Ohio State University, Ikove Venture Partners, and Ohio State professors. Nikola Labs specializes in wireless power solutions and radio frequency (RF) energy harvesting for mobile devices. The company's energy harvesting system converts ambient RF signals – such as Wi-Fi, Bluetooth and LTE — into usable DC power suitable for sensors and devices.

Nxtsens Microsystems Inc. (Montreal, Canada) founded in 2015 is designing temperature-compensated oscillators and other timing circuits. Based on proprietary technology that allows for the fabrication of resonators in a high-vacuum environment, Nxtsens uses wafer-level packaging.

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