ExaNoDe delivers 3DIC integrated compute element for exascale: Page 2 of 2

October 10, 2019 //By Julien Happich
Gathering thirteen partners from six European countries, the ExaNoDe (European Exascale Processor & Memory Node Design) project has pioneered 3DIC integration, global shared memory, and a complete software stack to create Europe’s first exascale compute node.

Finally, ExaNoDe’s research activities also extend to applications. Several application areas have been selected to ensure broad coverage, including materials science and engineering. So-called ‘mini applications’ – self-contained and based on real-life applications – have been developed and ported to the architecture via the programming models and communication application programming interfaces (APIs). Initial work has been performed to accelerate the key kernels on the compute node’s FPGA logic, and this expertise will be brought to future and ongoing projects such as EuroEXA. ETHZ developed the open source ExaConv convolutional neural network accelerator to accelerate neural network training as a demonstration of heterogeneous integration.

“Affordability and power consumption are the main hurdles for an exascale-class compute node. In the ExaNoDe project, we have built a complete prototype that integrates multiple core technologies: a 3D active interposer with chiplets, Arm cores with FPGA acceleration, a global address space, high-performance and productive programming environment, which will enable European technology to satisfy the requirements of exascale HPC”, commented Denis Dutoit, research engineer at CEA-Leti and the coordinator of ExaNoDe.

EuroEXA project - https://exanode.eu

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