Flexible fab could slash chip shortage

July 09, 2021 // By Nick Flaherty
Flexible fab could slash chip shortage
Richard Price, CTO at PragmatIC, talks to Nick Flaherty about a flexible fab approach that can slash the time taken to design and make a chip.

Silicon isn’t everything, says Richard Price at PragmatIC, a startup in Cambridge, UK specialising in flexible plastic chip technology. 

A recent finalist in the technology awards for the Royal Academy of Engineering, the company has developed a chip-making process it calls FlexLogIC that has a dramatically shorter design and production time, especially for chips on older process technologies. This can fundamentally change the way chips are designed, especially for low cost sensors in the Internet of Things (IoT) says Price.

“There is an intersection in the low end complexity and IoT and RFID where there isn’t a great deal of value in the conventional semiconductor production on older lines,” he said.

“We have a 0.8um technology and a roadmap to shrink that, certainly down to 300nm and we have R&D for that. It’s an NMOS technology which means it has some limitations in scalability, the noise margins and power. We have been working on CMOS and we expect to bring this into production over the next few years,” said Price.

“We are very comfortable with thousands of gates, and conceptually we can go 100 times more complex. A few thousand gates is a few square mm, and we have proven denser circuits. There’s quite a lot of process and design optimisation that can shrink that further.”

This is linked to the manufacturing process, which is based on a flexible substrate rather than silicon. The process technology can be set up quickly and relatively cheaply locally around the world.

“FlexLogic is our fab in a box and deploying these locally around the world to meet demand as a distributed megafab. We have a beta PDK [process design kit] with a formal release and we are working with a range of industry and academic design partners. Some are looking at proprietary RFID but we are working with ARM on designs,” said Price.

“The mini fabs can be built in 12 month process, but we know we can get that below 6 months ad as we start to do those simultaneous it can be under 4 months to add extra capacity. It’s a combination of our technology and working with our global partners as equipment providers,” he said. “We are planning our second installation in the UK which will be the blueprint for rolling this out and within the next two years we will be bringing online additional capacity outside the UK.”

Each of the distributed fabs can produce billions of flexICs per year each costing between one cent and ten cents.

“It’s a combination of product design and pushing the boundaries of the technology,” he said. “With ARM we published a paper in Nature Electronic that was a hardware optimisation of a machine learning engine for a sensor. This came out of an InnovateUK with the University of Manchester and Unilever looking at ways to produce a low cost sensors for volatile organic compounds, smells or signatures from food or other types of decay or even disease. There are implementations that make sense without CMOS,” he said.

This also changes the design process as a custom version of a chip can be designed and produce din just a few weeks, rather than months or years.

“One of the features of the technology is because the cost is low and the design cycle is short we can do multiple design iterations to get an optimised solutions so a general purpose controller may not make sense and that was the approach with the odour sensor with ARM. It allows you to strip out the complexity from the circuit,” he said.

“We are talking a week for the design cycle and manufacturing is days, and in many cases the applications are looking at large volumes of 10m or 100m devices, so the dynamics you see in silicon design are not the same for us,” he said. “There is a place for low complexity general purpose designs but a lot of what we see is hardware optimised for particular applications.”

The process can even integrate the passives from a PCB onto the chip, which helps boost recycling rates and reduce e-waste. “We can implement capacitors and resistors in the process as well,” he said.

Next: Plans for packaging


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