GaN-on-Silicon microLED full HD display makes debut: Page 2 of 2

May 14, 2019 //By Julien Happich
Together with its backplane partner, Jasper Display (JDC), Plessey has succeeded in the wafer level bonding of its GaN-on-Silicon monolithic microLED wafers with JDC’s eSP70 silicon patented backplane technology, resulting in microLED displays that contain addressable LEDs.

“This is a momentous milestone in the development of our monolithic microLED display technology. To the best of our knowledge this is truly a world first and we are extremely proud of this tremendous achievement. This is what the industry has been waiting for and opens up a new market for microLED emissive display applications”, expressed Dr Wei Sin Tan, Director of Epitaxy and Advanced Product Development at Plessey.

Jasper Display -

Plessey -

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