Glass interposer for next generation chiplet packaging

December 07, 2021 // By Nick Flaherty
Glass interposer for next generation chiplet packaging
Dai Nippon Printing (DNP) in Japan has developed an interposer on a glass substrate for next generation chiplet packaging

An interposer is a high-performance intermediate device that electrically connects multiple chips and substrates and the technology is expected to play a key role in next-generation semiconductor packaging.

The company has been part of the Jisso Open Innovation of Tops 2 (JOINT2) consortium with 11 other companies developing technologies for mass-production in 2024. The consortium is managed by Showa Denko Materials.

The interposer, which measures 40 x 40mm, overcomes the issue of an increase in wiring resistance, and degradation of insulation resistance between the wirings, to achieve the high-performance necessary for leading edge semiconductor packaging.

Related articles

DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by employing microfabrication technology based on printing processes.

“Through cooperation with the other participating JOINT2 companies, DNP will accelerate the further functionality of the interposer as well as advance initiatives aimed at mass production in 2024. We will also promote the development of next-generation semiconductor packaging technology,” said Ryoichi Ohigashi of the Research and Business Development Center, DNP.

Other articles on eeNews Europe

Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.