Global 300mm wafer fab count to reach 121 in 2019

March 18, 2019 //By Peter Clarke
Global 300mm wafer fab count to reach 121 in 2019
Nine 300mm wafer fabs are scheduled to open in 2019, five of them in China, according to market research firm IC Insights.

The nine new fabs in 2019 would be the most opened in a single year since 12 were opened in 2007.  Another six are scheduled to open in 2020.  All of the fabs coming on-stream in 2019 and 2020 will be for DRAM and flash memory or for foundry capacity.

Number of fabs processing 300mm-diameter wafers by year. Source: IC Insights.

The number of 300mm wafer fabs in production will increase to 138 by 2023.

Related links and articles:

www.icinsights.com

News articles:

Taiwan retains lead in global IC wafer capacity

ST starts construction of 300mm wafer fab

SK Hynix plans to invest $100 billion in fabs


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