Patton said that FDSOI has turned a corner in terms of the perceived risk. "Now the roadmap is not an issue; IP availability not an issue and so the perception of risk has come down. Another measure is our FDXelerator partnership program launched with 7 partners in 3Q16 and now has 47. We're heading towards 75 partners by the end of the year. We've had several real IC tape outs – rather than test chips – on 22FDX and we expect tape outs on 12FDX in 2020 with deliveries in 2021."
Patton stressed that RF elements and millimeter wave circuits on FDSOI are world class making the process good for automobile radar applications. Indeed, its 22FDX process has just been certified to AEC-Q100 Grade 2 for production. As a part of the AEC-Q100 Grade 2 certification, devices must successfully withstand reliability stress tests for an extended period of time, over a wide temperature range.
Globalfoundries offers the AutoPro platform to help customers migrate their automotive microcontrollers and ASSPs to 22FDX and take advantage of capabilities in RF and mmWave alongside logic, non-volatile memory (NVM) and high voltage devices.
Globalfoundries has been a pioneer of embedded MRAM (see Globalfoundries offers embedded MRAM on 22nm FDSOI) but other companies are offering alternatives. Samsung is offering both embedded MRAM and flash options on its 28nm FDSOI (see FDSOI to get embedded MRAM, flash options at 28nm) and STMicroelectronics has opted for phase-change memory on 28nm FDSOI (see ST samples MCU with embedded phase-change memory).
Meanwhile TSMC is offering MRAM and a variant of ReRAM as an embedded memory on its 22nm FinFET process, according to reports (see Report: TSMC to offer embedded ReRAM in 2019).
Next: Globalfoundries and next NVM