The SOM-8990 COM-HPC evaluation kit and SOM-DB8900 carrier board will use a 16 core 110W Intel Xeon processor for industrial IoT servers
the fourth quarter of 2020 with a server pinout equipped with a 16 core, 110W Intel Xeon D processor. This Size E board will measure 200 x 160 mm (0.65 x 0.52 in) and will have up to 512GB memory with 8pcs 288pin RDIMM/LRDIMM with up to 45 lanes PCIe Gen. 3 (x16, x8, x4, x1), four ports of USB 3.0 and two of SATA III and up to four ports of 10GBASE-KR and one 1000BASE-T.
Related COM-HPC articles
- FIRST BOARD WITH TIGER LAKE PROCESSORS FOR NEW STANDARD
- 10nm PROCESSORS POWER FIVE EDGE FORMATS
- CONGATEC IN €115M PRIVATE EQUITY DEAL
Other articles on eeNews Europe
