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Intel, Micron ready to make more 3D XPoint memory

Intel, Micron ready to make more 3D XPoint memory

Business news |
By Peter Clarke



Intel and Micron have announced the completion an expansion to Building 60 at the IM Flash Technologies LLC facilities in Lehi, Utah, for that purpose.

The IM Flash joint venture was created in 2006 to manufacture non-volatile memory for both Intel and Micron, starting with NAND for use in SSDs, phones, tablets and more. In 2015, IM Flash began manufacturing 3D XPoint technology which has a cell and array architecture that can switch faster than NAND.

The companies did not indicate what scale of addition to manufacturing the expansion to B60 will make.

Related links and articles:

www.intel.com

www.micron.com

News articles:

Intel launches SSD based on 3D XPoint memory

Is 3D XPoint based on phase-change memory?

ST opts for phase-change memory on 28nm FDSOI

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