Lowest power WiFi/Bluetooth module opens new applications

March 27, 2019 // By Rich Pell
Low-power Wi-Fi + Bluetooth module enables new class of products
Electronic component manufacturer Murata Manufacturing (Smyrna, GA) has announced that it has collaborated with Cypress Semiconductor (San Jose, CA) to develop what it says is the lowest power, small-form-factor Wi-Fi and Bluetooth module.

Based on the Cypress CYW43012 combo chipset, the Type 1LV ultra-small. dual-band Wi-Fi 11a/b/g/n/ (11ac Friendly) +Bluetooth 5.0 module provides data transference rates up to 78 Mbps on Wi-Fi and 3 Mbps on Bluetooth. The product, says the company, supports a broad range of popular processors as well as Linux and RTOS based applications and improves battery life in wearables, smart home products, and portable audio applications.

"Teaming with Cypress allows us to leverage our combined expertise in delivering breakthrough solutions that are game-changers for the market," says Mehul Udani, Director, Connectivity Solutions for Murata Americas. "Using our proprietary packaging and miniaturization technologies, Murata leads in developing turnkey, transformational tools that ease integration and enable connectivity to help bring IoT to fruition. With this lowest power Wi-Fi module, we now enable a new class of products that were previously designated for Bluetooth."

The Type 1LV, says the company, uses highly sophisticated and enhanced hardware mechanisms and algorithms to ensure that Wi-Fi and Bluetooth coexistence is optimized for maximum performance. An embedded Ipv6 network stack can be used to keep the host processor in sleep mode while maintaining network connections.

The module also supports BLE 2 Mbps, LE Secure Connections, LE Privacy 1.2, and LE Data Packet Length Extension. The device, says the company, operates seamlessly in dual-band networks with increased energy efficiency and enhanced security providing optimal performance in Wi-Fi 5 networks.

Measuring 10.0 (L) x 7.2 (W) x 1.4 (H) mm, the module will have a reference antennae design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market. The Type 1LV module is now in mass production.

Murata Manufacturing
Cypress Semiconductor

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