The collaboration will leverage GF’s 300mm silicon manufacturing process to deliver requisite cost, scale and capacity that is expected to enable mainstream L-PIC deployment for hyperscale data center interconnects and 5G network deployments at 100G, 400G and beyond.
90WG, built on the company’s 90nm SOI technology using 300mm wafer processing, enables low-cost integration of optical devices like modulators, multiplexers and detectors into a single silicon substrate.
L-PIC technology solves the remaining key challenge of aligning lasers to the silicon PIC. Leveraging patented Etched Facet Technology (EFT) lasers and a patented Self-Alignment EFT (SAEFT™) process, MACOM’s lasers are aligned and attached directly to the silicon photonics die with high speed and high coupling efficiency, thereby accelerating the adoption of silicon photonics in true industrial-scale applications.
See also: Smallest optical frequency comb to-date
The industry is entering a long upgrade cycle for high speed optical connectivity within cloud data centers as well as 5G optical buildouts. Industry forecasts project 2019, 2020 and beyond to be strong growth years for Coarse Wavelength Division Multiplexing (CWDM) and PAM-4, with the potential for overall unit demand in 2019, reaching volumes of 10 million units. With a track record of enabling 1.6 million ports in 2016, 4 million ports in 2017, and 6 million ports in 2018, MACOM will work with GF to scale L-PIC production aimed at meeting this exponentially growing market demand.