MACOM, GloFo to scale silicon photonics for data centers and 5G: Page 2 of 2

March 07, 2019 // By Jean-Pierre Joosting
MACOM, GloFo to scale silicon photonics for data centers and 5G
MACOM Technology Solutions and GlobalFoundries (GF) have announced a strategic collaboration to ramp the innovative Laser Photonic Integrated Circuit (L-PIC) platform from MACOM using GF’s current-generation 300mm-wafer silicon photonics offering, 90WG. Production scale of 300mm wafers is expected to enable exponential port growth in cloud data centers and 5G networks

“With the demand for bandwidth doubling inside data centers each year, cloud service providers are supply constrained in moving to 100G and beyond. On top of this, telecom carriers are now adopting the same CWDM and PAM-4 optical standards for their 5G Network buildouts. The ability to efficiently scale transceiver capacity and manufacturing throughput is critical,” said John Croteau, President and CEO of MACOM.

“With our deep manufacturing expertise, combined with MACOM’s strong technology, we can deliver differentiated silicon photonic solutions at scale, accelerate time-to-market, and reduce costs for client applications in Data Center and next-generation 5G optical networks,” said Tom Caulfield, CEO at GF.


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