The company is working on the integration of MLE into a new line of systems. It sees heterogeneous integration as a driving force for such back-end lithography, especially for advanced packaging, where the minimum resolution requirements for redistribution layers and interposers are becoming increasingly stringent, sometime exceeding two microns.
Die placement variation and the use of cost-efficient organic substrates require more flexibility in patterning and designers call for higher overlay accuracy as well as high depth of focus in vertical sidewall patterning. Minimizing pattern distortion and die shift due to wafer distortion in fan-out wafer level packaging (FoWLP) and support for thick and thin resists, are just some of the criteria for existing and future advanced packaging lithography systems.
The system can be scaled according to user needs by simply adding or removing UV exposure heads, so it can process a range of substrates from small silicon or compound semiconductor wafers up to panel sizes.
EV Group - www.EVGroup.com
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